Fingerprint capture array specification: 96*120            

Image resolution: 508dpi, 8-bit grey scale depth

Built-in touch wake-up, no need to touch the chip externally

Ringless design, no need to transmit excitation signals from the iron case.

High-speed SPI interface, support up to 16MHz

Operating voltage: 3V~3.6V

Minimal peripheral

LGA package size: φ14.6mm*0.72mm (maximum cut size)

ESD level: IEC 61000-4-2 Level 4 ±15KV air discharge

RoHS Compliant