The OpenMolding package—also known as the open-window package—is made from the same material as the LGA (Land Grid Array) package. The key difference lies in the packaging process: the OpenMolding package protects the chip’s bonding wires while leaving the sensing area exposed. In contrast, the LGA package fully encapsulates the sensing area with plastic sealing material.
As a result, the fingerprint recognition chip in the OpenMolding package offers the same high reliability as the LGA package, while delivering superior sensing sensitivity. This leads to clearer and more complete fingerprint images.